Hexamethyl disilylamine , Used for GC derivatives, ≥99.0%(GC) , 999-97-3
Synonym(s):
HMDS;Hexamethyldisilazane;Bis(trimethylsilyl)amine;1,1,1,3,3,3-Hexamethyldisilazane;Bis(trimethylsilyl)amine, HMDS
CAS NO.:999-97-3
Empirical Formula: C6H19NSi2
Molecular Weight: 161.39
MDL number: MFCD00008259
EINECS: 213-668-5
PRODUCT Properties
Melting point: | -78 °C |
Boiling point: | 125 °C (lit.) |
Density | 0.774 g/mL at 25 °C(lit.) |
vapor density | 4.6 (vs air) |
vapor pressure | 20 hPa (20 °C) |
refractive index | n |
Flash point: | 57.2 °F |
storage temp. | Store below +30°C. |
solubility | Miscible with acetone, benzene, ethyl ether, heptane and perchloroethylene. |
pka | 30(at 25℃) |
form | Liquid |
Specific Gravity | 0.774 |
color | Colorless |
Odor | Ammonia odour |
PH Range | 8.5 |
explosive limit | 0.8-25.9%(V) |
Water Solubility | REACTS |
Sensitive | Moisture Sensitive |
Hydrolytic Sensitivity | 7: reacts slowly with moisture/water |
Merck | 14,4689 |
BRN | 635752 |
InChIKey | FFUAGWLWBBFQJT-UHFFFAOYSA-N |
LogP | 0.23-1.19 at 20-25℃ |
CAS DataBase Reference | 999-97-3(CAS DataBase Reference) |
NIST Chemistry Reference | Silanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-(999-97-3) |
EPA Substance Registry System | Hexamethyldisilazane (999-97-3) |
Description and Uses
Hexamethyldisilazane is a bulk organo silicon compound, being a quite useful silanizing agent. It is a reagent for the preparation of trimethylsilyl derivatives. It can also be used to dehydrate cells of biomaterials for scanning electron microscopy (SEM). Moreover, it is an adhesion promoter for photoresist in photolithography, and is also useful in the pyrolysis-gas chromatography-mass spectrometry to enhance the detectability of compounds with polar functional groups.
Hexamethyldisilazane mainly used as methyl silane alkylation (such as amikacin, penicillin, cephalosporins and kinds of penicillin derivatives), hydroxyl protectants of antibiotics. It is used as surface treatment agent of diatomite, white carbon black, titanium and blond additives of photoresist in the semiconductor industry. It is used as treatment agent of tearing strength resistance. It is used as a solvent in organic synthesis and organometallic chemistry. It is used as an adhesion promoter for photoresist in photolithography. it is used for the preparation of trimethylsilyl ethers from hydroxy compounds. It is used as an alternative to critical point drying during sample preparation in electron microscopy. It is added to analyte to get silylated diagnostic products during pyrolysis in gas chromatography- mass spectrometry.
Safety
Symbol(GHS) | GHS02,GHS06 |
Signal word | Danger |
Hazard statements | H225-H302+H332-H311-H412 |
Precautionary statements | P210-P273-P280-P301+P312-P303+P361+P353-P304+P340+P312 |
Hazard Codes | F,C,Xn |
Risk Statements | 11-20/21/22-34-52/53 |
Safety Statements | 16-26-36/37/39-45-61 |
RIDADR | UN 3286 3/PG 2 |
WGK Germany | 2 |
RTECS | JM9230000 |
F | 21 |
Autoignition Temperature | 325 °C |
Hazard Note | Flammable |
TSCA | Yes |
HS Code | 2931 90 00 |
HazardClass | 3 |
PackingGroup | II |
Hazardous Substances Data | 999-97-3(Hazardous Substances Data) |
Toxicity | LDLO i.p. in mice: 650 mg/kg (Petrarch Systems Inc. Product Information Sheets) |