Home Categories Organic Chemistry Hexamethyl disilylamine
A4701212

Hexamethyl disilylamine , AR,98% , 999-97-3

Synonym(s):
HMDS;Hexamethyldisilazane;Bis(trimethylsilyl)amine;1,1,1,3,3,3-Hexamethyldisilazane;Bis(trimethylsilyl)amine, HMDS

CAS NO.:999-97-3

Empirical Formula: C6H19NSi2

Molecular Weight: 161.39

MDL number: MFCD00008259

EINECS: 213-668-5

Update time: 2022-07-08

PRODUCT Properties

Melting point: -78 °C
Boiling point: 125 °C (lit.)
Density  0.774 g/mL at 25 °C(lit.)
vapor density  4.6 (vs air)
vapor pressure  20 hPa (20 °C)
refractive index  n20/D 1.407(lit.)
Flash point: 57.2 °F
storage temp.  Store below +30°C.
solubility  Miscible with acetone, benzene, ethyl ether, heptane and perchloroethylene.
pka 30(at 25℃)
form  Liquid
Specific Gravity 0.774
color  Colorless
Odor Ammonia odour
PH Range 8.5
explosive limit 0.8-25.9%(V)
Water Solubility  REACTS
Sensitive  Moisture Sensitive
Hydrolytic Sensitivity 7: reacts slowly with moisture/water
Merck  14,4689
BRN  635752
InChIKey FFUAGWLWBBFQJT-UHFFFAOYSA-N
LogP 0.23-1.19 at 20-25℃
CAS DataBase Reference 999-97-3(CAS DataBase Reference)
NIST Chemistry Reference Silanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-(999-97-3)
EPA Substance Registry System Hexamethyldisilazane (999-97-3)

Description and Uses

Hexamethyldisilazane is a bulk organo silicon compound, being a quite useful silanizing agent. It is a reagent for the preparation of trimethylsilyl derivatives. It can also be used to dehydrate cells of biomaterials for scanning electron microscopy (SEM). Moreover, it is an adhesion promoter for photoresist in photolithography, and is also useful in the pyrolysis-gas chromatography-mass spectrometry to enhance the detectability of compounds with polar functional groups.

Hexamethyldisilazane mainly used as methyl silane alkylation (such as amikacin, penicillin, cephalosporins and kinds of penicillin derivatives), hydroxyl protectants of antibiotics. It is used as surface treatment agent of diatomite, white carbon black, titanium and blond additives of photoresist in the semiconductor industry. It is used as treatment agent of tearing strength resistance. It is used as a solvent in organic synthesis and organometallic chemistry. It is used as an adhesion promoter for photoresist in photolithography. it is used for the preparation of trimethylsilyl ethers from hydroxy compounds. It is used as an alternative to critical point drying during sample preparation in electron microscopy. It is added to analyte to get silylated diagnostic products during pyrolysis in gas chromatography- mass spectrometry.

Safety

Symbol(GHS) 
GHS02,GHS06
Signal word  Danger
Hazard statements  H225-H302+H332-H311-H412
Precautionary statements  P210-P273-P280-P301+P312-P303+P361+P353-P304+P340+P312
Hazard Codes  F,C,Xn
Risk Statements  11-20/21/22-34-52/53
Safety Statements  16-26-36/37/39-45-61
RIDADR  UN 3286 3/PG 2
WGK Germany  2
RTECS  JM9230000
21
Autoignition Temperature 325 °C
Hazard Note  Flammable
TSCA  Yes
HS Code  2931 90 00
HazardClass  3
PackingGroup  II
Hazardous Substances Data 999-97-3(Hazardous Substances Data)
Toxicity LDLO i.p. in mice: 650 mg/kg (Petrarch Systems Inc. Product Information Sheets)

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