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MR0803158

97% , 1825-58-7

Synonym(s):
Dimethylethoxyphenylsilane;Dimethylphenylethoxysilane

CAS NO.:1825-58-7

Empirical Formula: C10H16OSi

Molecular Weight: 180.32

MDL number: MFCD00053755

EINECS: 217-366-4

Pack Size Price Stock Quantity
10g RMB668.80 In Stock
50g RMB2658.40 In Stock
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Update time: 2022-07-08

PRODUCT Properties

Melting point: <0°C
Boiling point: 93 °C/25 mmHg (lit.)
Density  0.924 g/mL at 20 °C (lit.)
refractive index  n20/D 1.479
Flash point: 61°C
Specific Gravity 0.926
Hydrolytic Sensitivity 7: reacts slowly with moisture/water
BRN  2936696

Description and Uses

Ethoxydimethylphenylsilane can be used:

  • To functionalize SiO2 nanoparticles by the sol-gel method used in the bilayer coatings on a glass surface.
  • To functionalize the nanosized zeolites applicable in the catalysis.
  • As a substrate in the study of Si-O bond cleavage in the presence of serine hydrolases.

Safety

Symbol(GHS) 
GHS07
Signal word  Warning
Hazard statements  H315-H319-H335
Precautionary statements  P261-P305+P351+P338
Hazard Codes  Xi
Risk Statements  36/37/38
Safety Statements  26-36
WGK Germany  2
RTECS  VV3850000
10-21
TSCA  Yes

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