Resinepoxy , averageMw~700,000byGPC , 24969-06-0

Synonym(s):
Epichlorohydrin homopolymer;Epoxychloropropane homopolymer;Poly[(chloromethyl)ethylene oxide]

CAS NO.：24969-06-0

Empirical Formula: C3H5ClO

Molecular Weight: 92.52

MDL number: MFCD00084412

EINECS: 607-468-0

Update time: 2022-07-08

PRODUCT Properties

Melting point:	115-120 °C
Density	1.36 g/mL at 25 °C(lit.)
Tg	-22
Flash point:	252 °C
form	slab/chunk
Dielectric constant	2.5（Ambient）

Description and Uses

Resin based on epichlorohydrin and bis phenol A. Oligomers may vary in molecular weight from 340 and higher. May produce erythema multiforme like eruptions. The higher the molecular weight, the less sensitizing the compound.

Resin epoxy is Surface coatings, as on household appliances and gas storage vessels; adhesive for composites and for metals, glass, and ceramics; casting metalforming tools and dies; encapsulation of electrical parts; filament-wound pipe and pressure vessels; floor surf

Safety

Hazard Codes	Xi,N
Risk Statements	36/38-43-51/53
Safety Statements	24/25-61-37/39-28
RIDADR	UN 3082 9/PG 3
WGK Germany	3
RTECS	KC2100000
TSCA	TSCA listed
HS Code	39072090
Toxicity	LD50 oral in rat: 1200mg/kg