Diethoxydimethylsilane , 98% , 78-62-6

Synonym(s):
Dimethyldiethoxysilane

Update time: 2022-07-08

Melting point:	-97°C
Boiling point:	114 °C (lit.)
Density	0.865 g/mL at 25 °C (lit.)
vapor pressure	7-7910Pa at 20-25℃
refractive index	n20/D 1.381(lit.)
Flash point:	53 °F
storage temp.	Flammables area
form	liquid
Specific Gravity	0.939
color	≤25(APHA)
Water Solubility	may decompose
Sensitive	Moisture Sensitive
Hydrolytic Sensitivity	7: reacts slowly with moisture/water
BRN	1736110
Dielectric constant	3.2200000000000002
LogP	-0.4-3 at 25℃

Diethoxydimethylsilane may be used to modify epoxy resin6 and the surfaces of pure silica and Pd/SiO2 hydrogen gas sensors. Surface modification results in enhanced gas sensing properties of the sensors.
It may be used as a precursor for the synthesis of ultrafine SiC powder.
Diethoxydimethylsilane is an intermediate silane useful for blocking hydroxyl and amino groups in organic synthesis reactions. This silylating step allows subsequent reactions to be carried out which would be adversely affected by the presence of active hydrogen in the hydroxyl or amine groups. Following the reaction step, hydroxyl or amine groups blocked with diethoxydimethylsilane may be recovered by a hydrolysis procedure.
It is also used for preparing hydrophobic and release materials as well as enhancing flow of powders.
Studies report its use as a precursor for ORMOSIL (Organically modified SILicates) and thin a-SiOxCyHz films.